Micron Technology says its massive semiconductor manufacturing project in Clay, New York, remains on schedule according to its latest Environmental Impact Statement (EIS). The company is also accelerating construction at its Idaho facilities while reallocating portions of its CHIPS Act funding to meet evolving project priorities.
The updated EIS, provided to Tom’s Hardware, confirms that “there are no delays compared to the timelines that Micron announced in mid-2025.” The first New York fab will begin construction in late 2026, with completion expected in 2028 and production commencing around 2030.
Micron stated, “Micron remains focused on bringing leading-edge memory manufacturing to New York, and we appreciate the strong partnership with federal, state, and local authorities.”
According to the company’s U.S. expansion plan, site preparation for the first fab will start in late 2025, followed by construction from 2026 to 2028 or early 2029. The fab is projected to start DRAM production by early 2029 or 2030, depending on equipment installation cycles that can take up to two years.
The EIS outlines a long-term buildout for the Micron Clay campus, with additional fabs coming online over the next two decades. Construction for Fab 2 is set for the second half of 2028, Fab 3 for 2033, and Fab 4 for 2039. Once complete, the New York campus will be fully operational by 2045, five years behind the initial target but still aligned with the company’s revised planning horizon.
The EIS also notes, “Micron would mobilize for initial site preparation for the Proposed Project beginning in the fourth quarter of 2025, with the first two DRAM manufacturing facilities (Fabs 1 and 2) estimated to be operational by 2029 and 2030, respectively, and the remaining fabs (Fabs 3 and 4) estimated to be operational by 2035 and 2041.”
Meanwhile, Micron is fast-tracking its Idaho operations, specifically its ID2 fab, and has reportedly amended its $6.1 billion CHIPS Act funding agreement with the U.S. Department of Commerce. The company has redirected about $1.2 billion in federal funding from New York to Idaho, adjusting Clay’s allocation from $4.6 billion to $3.4 billion.
The move reflects a strategic reshuffling rather than a retreat, as Micron prioritizes near-term projects capable of delivering advanced DRAM and high-bandwidth memory (HBM) output sooner.
Local officials have acknowledged workforce and construction constraints affecting the New York site. Onondaga County Executive Ryan McMahon attributed schedule pressure to “widespread labor shortages and the longer construction cycles that have become the new normal in large-scale industrial projects.”
Micron’s adjusted rollout still aligns with its overarching goal to produce 40% of its DRAM output in the United States. The accelerated Idaho expansion will also support Micron’s new advanced packaging facility designed to handle HBM and other stacked memory technologies — key components in AI, cloud, and data center applications.
In the broader semiconductor race, Micron’s decision to rebalance its timelines and funding signals a pragmatic approach to ramping domestic capacity amid global supply chain pressures and labor market constraints.
Originally reported by Anton Shilov in Tom's Hardware.
