Micron Technology has pushed back construction on its massive $100 billion semiconductor megafab complex in Clay, New York, extending the original schedule by several years and shifting the start of major building phases through 2041, according to the project’s final environmental impact report.
The revised plan marks one of the most significant timeline resets for a U.S. chip manufacturing project under the CHIPS and Science Act era. Instead of seeing its first fab operational in 2028, Micron now expects production to begin in 2030, stretching the megaproject’s development across nearly two decades.
In a statement provided to NewsChannel 9 WSYR Syracuse, Micron said the decision reflects realistic build cycles for greenfield semiconductor plants:
“Based on construction timelines experience across the semiconductor industry for greenfield fabs in the United States, Micron has updated our projected operational milestones. We are well-positioned to proceed with confidence.”
The updated report details a significantly slower rollout:
Despite the revised sequencing, Micron noted that initial site preparation remains on track to begin this year at White Pine Commerce Park in Clay, where the four-fab complex is planned to rise.
Officials and industry analysts attribute the shift to several ongoing challenges across the semiconductor sector:
Onondaga County Executive Ryan McMahon told Tom’s Hardware that the region is experiencing many of the same pressures that other chip-building hubs—like Arizona and Texas—have reported.
The Rhode Island-based contractor Gilbane was awarded the preconstruction package in August to prepare the site for major development stages. Those activities include mass grading, utilities extension, project logistics, and early civil work needed to support long-term buildout.
Neither Micron nor Gilbane responded to questions regarding the schedule changes.
While the New York megafab is being stretched over a longer horizon, Micron is ramping up activity elsewhere. The company has reallocated about $1.2 billion in federal CHIPS funding away from New York to accelerate work at its ID2 fab in Boise, Idaho, according to reporting from Tom’s Hardware.
That funding came from the U.S. Department of Commerce, which finalized up to $6.165 billion in direct CHIPS Incentives Program support in December 2024 to help finance Micron’s multi-state megaproject pipeline.
Even with delays, state and local leaders say Micron’s investment remains transformative. The project is expected to generate thousands of construction jobs and long-term semiconductor manufacturing positions, while anchoring New York’s bid to become a national hub for next-generation memory chip production.
Micron emphasized in its filings that the long-term vision for the Clay campus has not changed—only the pace at which it will come to fruition.
Originally reported by Sebastian Obando in Construction Dive.
