
ALBANY, N.Y. — New York State has reached a major milestone in its semiconductor strategy with the arrival of the first major components of ASML’s High Numerical Aperture (High NA) Extreme Ultraviolet (EUV) lithography system at the NY Creates Albany NanoTech Complex. The delivery marks the next phase in developing North America's first accessible High NA EUV Lithography Center, designed to accelerate advanced semiconductor research and chip development.
The arrival of the bottom main module follows the earlier delivery of a Tokyo Electron system earlier this year. Additional High NA EUV components are scheduled to arrive throughout the summer as installation progresses.
The new lithography center is supported by a $1 billion investment from New York State, which is expected to leverage approximately $9 billion in private industry investment. State officials said the initiative will generate hundreds of permanent jobs while strengthening the domestic semiconductor research ecosystem.
The ASML High NA EUV platform is designed to enable development of semiconductor technologies below the 1-nanometer process node, providing researchers and industry partners with access to one of the world's most advanced chip fabrication technologies.
Governor Kathy Hochul said the project reinforces New York's position as a national center for semiconductor innovation by bringing advanced chipmaking capabilities to the Albany NanoTech Complex.
State officials said the High NA EUV Center will support collaboration among semiconductor manufacturers, equipment suppliers, researchers, and technology developers focused on next-generation chip design and manufacturing.
Empire State Development President, CEO and Commissioner Hope Knight said the investment strengthens New York's semiconductor innovation ecosystem, helps attract global industry partners, and supports future high-skilled manufacturing and research jobs.
The Albany NanoTech Complex continues to expand its advanced semiconductor infrastructure as part of broader efforts to grow domestic chip research, development, and manufacturing capabilities in the United States.
Source: ESD.